OEM Manufacturer EVA Bags for rubber - Low Melt Bags for Plastic Compounding – Zonpak
OEM Manufacturer EVA Bags for rubber - Low Melt Bags for Plastic Compounding – Zonpak Detail:
ZonpakTM low melt bags are used to pack compounding ingredients (e.g. process oil and powder additives) in plastic compounding and mixing process. Due to the property of low melting point and good compatibility with plastics, the bags together with the packed additives and chemicals can be direct put into a mixer, so it can provide cleaner work environment and accurate adding of additives. Using the bags can help plants get uniform compounds while saving additives and time.
Melting point, size and color can be customized according to the customer’s specific application requirement.
Technical Standards |
|
Melting point | 65-110 deg. C |
Physical properties | |
Tensile strength | MD ≥16MPa TD ≥16MPa |
Elongation at break | MD ≥400% TD ≥400% |
Modulus at 100% elongation | MD ≥6MPa TD ≥3MPa |
Appearance | |
Surface of the product is flat and smooth, there is no wrinkle, no bubble. |
Product detail pictures:


Related Product Guide:
Our enterprise insists all along the standard policy of "product high-quality is base of business survival; client satisfaction could be the staring point and ending of an business; persistent improvement is eternal pursuit of staff" as well as consistent purpose of "reputation first, client first" for OEM Manufacturer EVA Bags for rubber - Low Melt Bags for Plastic Compounding – Zonpak, The product will supply to all over the world, such as: Sierra Leone , Accra , Lesotho , We only supply quality products and we believe this is the only way to keep business continue. We can supply custom service too such as Logo, custom size, or custom products etc that can according to customer's requirement.

With a positive attitude of "regard the market, regard the custom, regard the science", the company works actively to do research and development. Hope we have a future business relationships and achieving mutual success.
